Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations

ISSN： 0305-6120

Source： Circuit World, Vol.28, Iss.2, 2002-06, pp. : 32-38

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

New materials and build-up constructions for advanced rigid-flex PCB applications

By Rapala-Virtanen Tarja Jokela Timo

Circuit World, Vol. 31, Iss. 4, 2005-12 ,pp. : 21-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Elastic, elastic-plastic and creep analyses of wafer level chip scale package solder joints on microvia build-up printed circuit boards

By Lau John H

Circuit World, Vol. 27, Iss. 1, 2001-01 ,pp. : 20-31

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Stress analysis for fracturing potential of blind via in a build-up substrate

By Wang Tong Hong Lai Yi-Shao

Circuit World, Vol. 32, Iss. 2, 2006-05 ,pp. : 39-44

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

PCB process mechanization: various ways to automate

By Holden Happy

Circuit World, Vol. 36, Iss. 3, 2010-08 ,pp. : 14-22

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Manufacturing Cost Analysis of Surface Mount PCB Designs

By Alexander M. Srihari K. Emerson C.R.

Circuit World, Vol. 20, Iss. 2, 1993-12 ,pp. : 28-32

Emerald Group Publishing Ltd

Access to resources Recommend Favorite