Micro via filling plating technology for IC substrate applications

By Yeh Cheng-Ching   Lan Kuo-Hsing   Dow Wei-Ping   Hsu Jui-Hsia   Lee Cliff   Hsu Chih-Hao   Lee Ken   Chen Jordan   Lu Philip  

Circuit World, Vol. 30, Iss. 3, 2004-09 ,pp. : 26-32

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging

By Tummala Rao  

Journal of Electroceramics, Vol. 13, Iss. 1-3, 2004-07 ,pp. : 417-422

Springer Publishing Company

Access to resources Recommend Favorite

Substrate effect on the temperature coefficient of resistance of La 0.7 Ca 0.3 MnO 3 thin films prepared by metal organic deposition

By Daoudi K.   Tsuchiya T.   Yamaguchi I.   Manabe T.   Mizuta S.   Kumagai T.  

Journal of Electroceramics, Vol. 16, Iss. 4, 2006-07 ,pp. : 527-532

Springer Publishing Company

Access to resources Recommend Favorite

Polyethersulphone—A Thermoplastic PCB Substrate

By Thompson M.K.  

Circuit World, Vol. 9, Iss. 3, 1993-12 ,pp. : 41-45

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

A solution of aluminum substrate drilling

By Song Fumin   Fu Lianyu   Zhang Fei  

Circuit World, Vol. 37, Iss. 2, 2011-05 ,pp. : 3-7

Emerald Group Publishing Ltd

Access to resources Recommend Favorite