Immersion tin: a proven final finish for printed circuit boards providing reliable solderability and marginal formation of tin-whiskers

By Meeh Peter  

Circuit World, Vol. 31, Iss. 1, 2004-09 ,pp. : 28-40

Emerald Group Publishing Ltd

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Use of Organic Metal to enhance the operating window and solderability of immersion tin

By Wessling Bernhard  

Circuit World, Vol. 25, Iss. 4, 1999-04 ,pp. : 8-16

Emerald Group Publishing Ltd

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Quality assessment: 14—Intermetallic compound formation

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Circuit World, Vol. 5, Iss. 3, 1993-12 ,pp. : 17-18

Emerald Group Publishing Ltd

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The advantages of mildly alkaline immersion silver as a final finish for solderability

By Fang Jing Li   Chan Daniel K.  

Circuit World, Vol. 33, Iss. 2, 2007-05 ,pp. : 43-51

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Solderability Preservative Coatings: Electroless Tin vs Organic Azoles

By Artaki I.   Ray U.   Jackson A.M.   Gordon H.M.   Vianco P.T.  

Circuit World, Vol. 20, Iss. 3, 1993-12 ,pp. : 23-26

Emerald Group Publishing Ltd

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