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Circuit World, Vol. 39, Iss. 1, 2013-02 ,pp. : 4-8

Emerald Group Publishing Ltd

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Organic substrates for environmentally friendly electronic devices

By Fischer T   Hähnlein J   Haas W   Landes V  

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Surface Mount Assembly Problems Elimination of PC Solder Resist

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Failure mechanism of solder bubbles in PCB vias during high-temperature assembly

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Emerald Group Publishing Ltd

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Development of a new, more efficient and environmentally friendly method of producing high density interconnects - the "PRIME" process

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