Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder

Author: Hetschel Thomas   Wolter Klaus-Jürgen   Phillipp Fritz  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.35, Iss.2, 2009-05, pp. : 37-44

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Abstract