New non-reinforced substrates for use as embedded capacitors

By Andresakis John   Yamamoto Takuya   Biunno Nick  

Circuit World, Vol. 30, Iss. 1, 2004-01 ,pp. : 36-41

Emerald Group Publishing Ltd

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Process development for PWB compatible embedded capacitors

By Bhattacharya Swapan K   Raj P Markondeya   Balaraman Devarajan   Windlass Hitesh   Tummala Rao R  

Circuit World, Vol. 30, Iss. 1, 2004-01 ,pp. : 31-35

Emerald Group Publishing Ltd

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Low-power noise multilayer PCB with discrete decoupling capacitors inside

By Song Ki-Jae   Kim Jongmin   Yoo Jongwoon   Nah Wansoo   Lee Jaeil   Sim Hyunseop  

Circuit World, Vol. 35, Iss. 2, 2009-05 ,pp. : 30-36

Emerald Group Publishing Ltd

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Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP)

By Das Rabindra N.   Rosser Steven G.   Papathomas Konstantinos I.   Antesberger Tim   Markovich Voya R.  

Circuit World, Vol. 35, Iss. 4, 2009-11 ,pp. : 31-39

Emerald Group Publishing Ltd

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Packages for High-density Surface-mount Applications

By Love G.F.  

Circuit World, Vol. 13, Iss. 3, 1993-12 ,pp. : 36-39

Emerald Group Publishing Ltd

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