Popcorning in Fully Populated and Perimeter Plastic Ball Grid Array Packages*

Author： Munamarty R   McCluskey P   Pecht M   Yip** L  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.8, Iss.1, 1996-01, pp. : 46-50

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Solder ball failure mechanisms in plastic ball grid array packages

By Zhong C.H.   Yi S.   Whalley D.C.  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 40-50

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Solder joint reliability of plastic ball grid array packages

By Zhong Chong Hua   Yi Sung  

Soldering & Surface Mount Technology, Vol. 11, Iss. 1, 1999-01 ,pp. : 44-48

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Solder joint reliability of cavity-down plastic ball grid array assemblies

By Lee S.-W. Ricky   Lau John H  

Soldering & Surface Mount Technology, Vol. 10, Iss. 1, 1998-01 ,pp. : 26-31

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Solder joint reliability of plastic ball grid array with solder bumped flip chip

By Lee Shi-Wei Ricky   Lau John H  

Soldering & Surface Mount Technology, Vol. 12, Iss. 2, 2000-02 ,pp. : 16-23

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Reduction of voiding in eutectic ball grid array solder joints

By Casey William  

Soldering & Surface Mount Technology, Vol. 11, Iss. 2, 1999-02 ,pp. : 12-16

Emerald Group Publishing Ltd

Access to resources Recommend Favorite