New High Thermal Conductivity Thermoplastics for Power Applications*

Author： Dietz R L   Peck D   Robinson P J   Firmstone **- M G   Bartholomew** P.M.   Paterson** G  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.9, Iss.2, 1997-02, pp. : 55-57

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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