Mastering Resin

Author: Richard Hightower  

Publisher: John Wiley & Sons Inc‎

Publication year: 2003

E-ISBN: 9780471467465

P-ISBN(Paperback): 9780471431039

P-ISBN(Hardback):  9780471431039

Subject: TP312 程序语言、算法语言

Language: ENG

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Description

  • The official guide to Resin, authorized by the company that invented the product, Caucho Technology
  • Offers a comprehensive tutorial and reference on how to use all flavors of Resin, including the basic Resin server, Resin-CMP, and Resin-Enterprise
  • Demonstrates how to build enterprise Java applications, optimize performance, and use other tools with Resin
  • Illustrates how to configure Resin for various commercial and open source hardware platforms, maintain high availability of the server, and use all of the advanced features
  • Companion Web site includes updates on the technology and links to useful resources and tools

Chapter

Contents

pp.:  1 – 5

Acknowledgments

pp.:  5 – 13

About the Authors

pp.:  13 – 15

Introduction

pp.:  15 – 17

Chapter 1: An Overview of Resin

pp.:  17 – 23

Chapter 3: Using JSP and Resin

pp.:  33 – 53

Chapter 4: Using Servlets and Resin

pp.:  53 – 75

Chapter 5: Using XTP and StyleScript

pp.:  75 – 95

Chapter 6: Object-Relational Mapping with CMP

pp.:  95 – 129

Chapter 7: Using XDoclet with Resin

pp.:  129 – 173

Chapter 8: The Burlap Web Service Protocol

pp.:  173 – 185

Chapter 9: Hessian Binary Web Service Protocol

pp.:  185 – 201

Chapter 10: Parsing

pp.:  201 – 221

Chapter 11: Database Connectivity

pp.:  221 – 229

Chapter 12: Debugging and Logging

pp.:  229 – 243

Chapter 13: Security

pp.:  243 – 253

Chapter 14: Page Caching

pp.:  253 – 267

Chapter 15: Resin Server Configuration

pp.:  267 – 275

Chapter 16: Configuring Your Web Server

pp.:  275 – 311

Chapter 17: Exploring Virtual Hosting

pp.:  311 – 329

Chapter 18: Using Resin HardCore

pp.:  329 – 335

Chapter 19: Load Balancing and Reliability

pp.:  335 – 337

Appendix A: Resin Sources

pp.:  337 – 347

Appendix B: Resin Status

pp.:  347 – 351

Appendix C: Resin and Eclipse

pp.:  351 – 357

Appendix D: Burlap and Hessian APIs

pp.:  357 – 365

Index

pp.:  365 – 385

LastPages

pp.:  385 – 410

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