Thermal Fluctuations Limit the Adhesive Strength of Compliant Solids

Author： Tang Tian   Jagota Anand   Chaudhury Manoj K.   Hui Chung-Yuen  

Publisher： Taylor & Francis Ltd

ISSN： 0021-8464

Source： Journal of Adhesion, Vol.82, Iss.7, 2006-06, pp. : 671-696

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