Adhesion-Delamination Mechanics of a Prestressed Circular Film Adhered onto a Rigid Substrate

Author： Wong Ming-fung   Duan Gang   Wan Kai-tak  

Publisher： Taylor & Francis Ltd

ISSN： 0021-8464

Source： Journal of Adhesion, Vol.83, Iss.1, 2007-01, pp. : 67-83

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

ADHESION OF A FLAT PUNCH ADHERED TO A THIN PRE-STRESSED MEMBRANE

By Wan Kai-Tak   Dillard David A.  

Journal of Adhesion, Vol. 79, Iss. 2, 2003-02 ,pp. : 123-140

Taylor & Francis Ltd

Access to resources Recommend Favorite

Adhesion of an Elastic Convex Shell onto a Rigid Plate

By Shi Jiayi   Müftü Sinan   Wan Kai-Tak  

Journal of Adhesion, Vol. 87, Iss. 6, 2011-06 ,pp. : 579-594

Taylor & Francis Ltd

Access to resources Recommend Favorite

Effect of TiN/C Microstructure Composite Layer on the Adhesion of FDLC Film onto Silicon Substrate

By Xiao Jianrong   Gong Chenyang   Qi Meng   Jiang Aihua   Wang Zhiyong   Li Ming   Ma Jiafeng  

Coatings, Vol. 8, Iss. 1, 2018-01 ,pp. : 18-18

MDPI

Access to resources Recommend Favorite

Uniform Thin Film Electrodeposition onto Large Circular Wafer Substrates

By Ortiz-Ibarra Hector   Medina J.  

Journal of Applied Electrochemistry, Vol. 34, Iss. 7, 2004-07 ,pp. : 751-756

Springer Publishing Company

Access to resources Recommend Favorite

Drift Study of Hematite Adhered onto Silver and Mercury

By  

Journal of Colloid and Interface Science, Vol. 176, Iss. 2, 1995-12 ,pp. : 495-497

Academic Press

Access to resources Recommend Favorite