Experimental Study and Modelling of an Adhesive-Bonded Polycarbonate Assembly for Application in Consumer Electronics

Author： Kok C. K.   Ooi C. C.   Ng J. J.   Liew K. W.  

Publisher： Taylor & Francis Ltd

ISSN： 0021-8464

Source： Journal of Adhesion, Vol.89, Iss.4, 2013-04, pp. : 247-263

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