The Preparation and Cure Kinetics Researches of Thermal Conductivity Epoxy/AlN Composites

Author： Ma Aijie Chen Weixing Hou Yonggang Zhang Gai

ISSN： 0360-2559

Source： Polymer-Plastics Technology and Engineering, Vol.49, Iss.4, 2010-01, pp. : 354-358

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Abstract

The aluminum nitride (AlN) was employed to prepare epoxy/AlN composites by blending-casting moulding method, two different coupling agents were used to functionalize the surface of AlN. The thermal conductivity and mechanical properties of the composites were investigated. And the cure kinetics of the EP/AlN composites was studied by means of isothermal DSC. Results revealed that the thermal conductivity of EP improved remarkably with the addition of AlN, a higher thermal conductivity of 1.05 W/mK can be achieved with 42 vol% AlN, about 5 times higher than that of native epoxy resin. And the flexural and impact strength of the EP/AlN composites were optimal with 3.3 vol% AlN. The curing process of the EP/AlN composites contained autocatalytic mechanism, the whole process was according with the Kamal model. The presence of AlN did not change the cure reaction mechanism, and had little effecting on the activation energy, but decreased the rate constants kl and k2.