Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

Author: Verdingovas V   Jellesen M S   Ambat R  

Publisher: Maney Publishing

ISSN: 1743-2782

Source: Corrosion Engineering, Science and Technology, Vol.48, Iss.6, 2013-09, pp. : 426-435

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Abstract