Adsorption Equilibrium of Polyethylene Glycol in the Copper Electroplating Solution on Activated Carbon

Author: Chang C-F.   Chang C-Y.   Tsai W-T.   Wu S-C.  

Publisher: Academic Press

ISSN: 0021-9797

Source: Journal of Colloid and Interface Science, Vol.232, Iss.1, 2000-12, pp. : 207-209

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