New Reconfigurable Fiber–Chip Coupling Method for Multipurpose Packaging with up to 50 GHz Modulation Bandwidth

Author： Fischer U.H.P.   Peters K.   Ziegler R.   Pech D.   Kilk A.   Eckhardt T.   Mekonnen G.G.   Jacumeit G.  

Publisher： Academic Press

ISSN： 1068-5200

Source： Optical Fiber Technology, Vol.6, Iss.1, 2000-01, pp. : 68-73

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