Minimal Processing Technologies in the Food Industries ( Woodhead Publishing Series in Food Science, Technology and Nutrition )

Publication series :Woodhead Publishing Series in Food Science, Technology and Nutrition

Author: Ohlsson   T;Bengtsson   N  

Publisher: Elsevier Science‎

Publication year: 2002

E-ISBN: 9781855736795

P-ISBN(Paperback): 9781855735477

P-ISBN(Hardback):  9781855735477

Subject: TS2 food industry

Language: ENG

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Description

The emergence of ‘minimal’ processing techniques, which have a limited impact on a food’s nutritional and sensory properties, has been a major new development in the food industry. This book provides an authoritative review of the range of minimal techniques currently available, their applications and safety and quality issues.

  • Reviews the range of minimal processing techniques, their advantages and disadvantages and their use in food production
  • Discusses the range of thermal technologies, such as infrared heating, ohmic heating, and dielectric methods, including the use of microwaves
  • Presents alternatives to thermal processing, ranging from irradiation to high pressure processing and the use of pulsed electric fields

Chapter

Front Cover

pp.:  1 – 4

Copyright Page

pp.:  5 – 6

Table of Contents

pp.:  6 – 12

List of contributors

pp.:  12 – 16

Foreword

pp.:  16 – 18

Chapter 1. Introduction

pp.:  18 – 21

Chapter 2. Minimal processing of foods with thermal methods

pp.:  21 – 51

Chapter 3. Minimal processing of foods with non-thermal methods

pp.:  51 – 78

Chapter 4. Modified atmosphere packaging

pp.:  78 – 104

Chapter 5. Active and intelligent packaging

pp.:  104 – 141

Chapter 6. Natural food preservatives

pp.:  141 – 192

Chapter 7. The hurdle concept

pp.:  192 – 213

Chapter 8. Safety criteria for minimally processed foods

pp.:  213 – 236

Chapter 9. Minimal processing in practice: fresh fruits and vegetables

pp.:  236 – 262

Chapter 10. Minimal processing in practice: seafood

pp.:  262 – 284

Chapter 11. Minimal processing in the future: integration across the supply chain

pp.:  284 – 299

Index

pp.:  299 – 306

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