Science and Technology of Defects in Silicon ( Volume 9 )

Publication series :Volume 9

Author: Ammerlaan   C. A. J.;Chantre   A.;Wagner   P.  

Publisher: Elsevier Science‎

Publication year: 2014

E-ISBN: 9780080983646

P-ISBN(Paperback): 9780444886194

P-ISBN(Hardback):  9780444886194

Subject: TB3 Engineering Materials;TN4 microelectronics, integrated circuit (IC)

Language: ENG

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Description

This volume reviews recent developments in the materials science of silicon. The topics discussed range from the fundamental characterization of the physical properties to the assessment of materials for device applications, and include: crystal growth; process-induced defects; topography; hydrogenation of silicon; impurities; and complexes and interactions between impurities.

In view of its key position within the conference scope, several papers examine process induced defects: defects due to ion implantation, silicidation and dry etching, with emphasis being placed on the device aspects. Special attention is also paid to recent developments in characterization techniques on epitaxially grown silicon, and silicon-on-insulators.

Chapter

Front Cover

pp.:  1 – 4

Defects in Silicon

pp.:  4 – 5

Copyright Page

pp.:  5 – 8

Preface

pp.:  6 – 14

Table of Contents

pp.:  8 – 6

Chapter 3. Hydrogen in silicon: state, reactivity and evolution after ion implantation

pp.:  32 – 38

Chapter 4. Pairing of acceptors with interstitial donors in silicon and germanium

pp.:  38 – 44

Chapter 5. Hydrogen passivation and thermal reactivation of zinc double acceptors in silicon

pp.:  44 – 48

Capter 6. A Hydrogen-Carbo n Relate d Deep Donor in Crystalline n-Si:C

pp.:  48 – 54

Chapter 7. Radiative recombination channels due to hydrogen in crystalline silicon

pp.:  54 – 60

Chapter 8. Defects created by hydrogen implantation into silicon

pp.:  60 – 64

Chapter 9. Hydrogenation of shallow and deep levels in silicon

pp.:  64 – 70

Chapter 10. Hydrogen-related vibrations in crystalline silicon

pp.:  70 – 76

Chapter 11. Transition metals in silicon and their gettering behaviour

pp.:  76 – 84

Chapter 12. Donor formation in silicon owing to ion implantation of the rare earth metal erbium

pp.:  84 – 88

Chapter 13. 1.54 μm photoluminescence of erbium-implanted silicon

pp.:  88 – 92

Chapter 14. Fast-diffusing defects induced by copper in silicon

pp.:  92 – 96

Chapter 15. Quenched-in, fast-diffusing defects in silicon studied by the perturbed angular correlation method

pp.:  96 – 100

Chapter 16. Recent developments in ion implantation in silicon

pp.:  100 – 108

Chapter 17. A study of carbon-implanted silicon for light-emittin g diode fabrication

pp.:  108 – 114

Chapter 18. Role of point defects in the transient diffusion and clustering of implanted boron in silicon

pp.:  114 – 120

Chapter 19. The effect of phosphorus background concentration on the diffusion of tin , arsenic and antimony in silicon

pp.:  120 – 126

Chapter 20. Heavy metal contamination during integrated-circuit processing : measurements of contamination level and internal gettering efficiency by surface photovoltage

pp.:  126 – 136

Chapter 21. Electronic behaviour of decorated stacking faults in silicon

pp.:  136 – 142

Chapter 22. Activation and gettering of intrinsic metallic impurities during rapid thermal processing

pp.:  142 – 146

Chapter 23. Gold diffusion in silicon: enhanced substitutional gold formation by rhodium doping

pp.:  146 – 152

Chapter 24. Effect of deformation-induced defects on the Fermi level position at recombination centers in n-Si

pp.:  152 – 156

Chapter 25. Precipitation at grain boundaries in silicon

pp.:  156 – 160

Chapter 26. Effects of deuterium plasma treatments on the electrical properties of boron-doped silicon

pp.:  160 – 166

Chapter 27. Modelling of recombination activity and passivation by hydrogen of dislocations in silicon wafers

pp.:  166 – 170

Chapter 28. Formation of buried CoSi 2 layers by ion implantation, studied by Mossbauer spectroscopy and Rutherford backscattering spectroscopy

pp.:  170 – 176

Chapter 29. Hall effect spectroscopy of thermal donors in silicon films synthesized by oxygen implantation

pp.:  176 – 182

Chapter 30. Perturbed angular correlation spectroscopy of acceptor-donor pairs in silicon, germanium and GaAs

pp.:  182 – 186

Chapter 31. Optical absorption by platinum in crystallin silicon

pp.:  186 – 192

Chapter 32. Surface characterization of high-dose Sb + implanted rapid thermal annealed monocrystalline silicon

pp.:  192 – 198

Chapter 33. Chromium diffusivity in boron-doped silicon: reassessmen to f the activation energy from low tempera ture measurements

pp.:  198 – 202

Chapter 34. Regrowth of indium-implanted (100), (110 ) and (111) silicon crystals studied with Rutherford backscattering and perturbed angular correlation techniques

pp.:  202 – 210

Chapter 35. Substrate-damage-free laser recrystallization of polycrystalline silicon

pp.:  210 – 214

Chapter 36. A photoluminescence study of zinc-implanted silicon

pp.:  214 – 218

Chapter 37. Kinetics of silicon amorphization by N + implantation: dose rate and substrate temperature effects

pp.:  218 – 224

Chapter 38. Defects and solidification front morphologies in lamp zone-melting-recrystallized silicon-on-insulator films

pp.:  224 – 230

Chapter 39. Strain compensation effects on the annealing of Ge +-B +-implanted silicon

pp.:  230 – 236

Chapter 40. Correlation of thermal history and thermal donor formation

pp.:  236 – 244

Chapter 41. RTA-induced defects: a comparison between lamp and electron beam techniques

pp.:  244 – 250

Chapter 42. Seeding recrystallization for producing thick silicon-on-insulator films on non-planar substrates

pp.:  250 – 256

Chapter 43. Investigation on the electrically inactive antimony at thermal equilibrium in silicon

pp.:  256 – 260

Chapter 44. Four-vacancy damage clusters in neutron-irradiated silicon

pp.:  260 – 264

Chapter 45. Iron diffusivity measurement with deep-level transient spectroscopy at room temperature

pp.:  264 – 270

Chapter 46. Thermal annealing of excimer-laser-induced defects in virgin silicon

pp.:  270 – 274

Chapter 47. New photoluminescence lines in selenium-doped silicon

pp.:  274 – 278

Chapter 48. Damage-free reactive ion etching of silicon in NF3 at low temperature

pp.:  278 – 282

Chapter 49. A uniaxial stress study of a copper-related photoluminescence band in silicon

pp.:  282 – 286

Chapter 50. Luminescence from transition metal centres in silicon doped with silver and nickel

pp.:  286 – 290

Chapter 51. Near-surface electrical effects of oxidation and hydrogenation in silicon

pp.:  290 – 294

Chapter 52. Perturbed angular correlation spectroscopy of hydrogen-passivated indium acceptors in silicon

pp.:  294 – 298

Chapter 53. Hydrogen-related electron traps in proton-bombarded float zone silicon

pp.:  298 – 304

Chapter 54. Thermal donors and oxygen-related complexes in silicon

pp.:  304 – 312

Chapter 55. Enhanced thermal donor formation and oxygen diffusion in silicon exposed to a hydrogen plasma

pp.:  312 – 316

Chapter 56. Isoelectronic bound exciton photoluminescence from a metastable defect in sulphur-doped silicon

pp.:  316 – 322

Chapter 57. In-diffusion of nitrogen from N2 ambient and its aggregation at lattice imperfections in silicon crystals

pp.:  322 – 328

Chapter 58. Ab-initio calculation so f hyperfine fields for chalcogen point defects and defect pairs in silicon: identification of the pair atomic structure

pp.:  328 – 334

Chapter 59. The effect of suicides on the induction and removal of defects in silicon

pp.:  334 – 344

Chapter 60. Effect of post-metallization annealing on W/Cr-metallized silicon junctions

pp.:  344 – 348

Chapter 61. Dislocations and mechanical properties of silicon

pp.:  348 – 356

Chapter 62. Processing effects on the electrical properties of defects in silicon

pp.:  356 – 360

Chapter 63. LBIC measurements of the recombining activity of dislocations in float zone silicon

pp.:  360 – 366

Chapter 64. Effect of oxygen and carbon segregation on the electrical properties of grain boundaries in silicon

pp.:  366 – 372

Chapter 65. Defect-related gate oxide breakdown

pp.:  372 – 380

Chapter 66. Increase of low-frequency-noise-generating defects in today's CMOS and BiCMOS technologies

pp.:  380 – 386

Chapter 67. Characterization of macroscopic defects in silicon after processing for CMOS and bipolar circuits

pp.:  386 – 390

Chapter 68. Reduction of process-induced defects in power devices

pp.:  390 – 396

Chapter 69. Effect of N+ ion implantation on the oxidation of silicon and metal–oxide–semiconductor characteristics

pp.:  396 – 400

Chapter 70. Effect of sputter-etching conditions on the barrier characteristics and the process-induced defects in (Ti-W)/Si Schottky diodes

pp.:  400 – 406

Chapter 71. Simulation of oxygen precipitation in Czochralski grown silicon

pp.:  406 – 414

Chapter 72. The role of atmospheric oxygen and water in the generation of water marks on the silicon surface in cleaning processes

pp.:  414 – 420

Chapter 73. Epitaxial silicon chemical vapor deposition below atmospheric pressure

pp.:  420 – 430

Chapter 74. The formation of dislocations and their in-situ detection during silicon vapour phase epitaxy at reduced temperature

pp.:  430 – 436

Chapter 75. A study of growth defects in seeded and unseeded silicon on insulator layers

pp.:  436 – 442

Chapter 76. High quality silicon-on-insulator substrates by implanted oxygen ions

pp.:  442 – 448

Chapter 77. Epitaxial silicon growth on porous silicon by reduced pressure, low temperature chemical vapour deposition

pp.:  448 – 454

Chapter 78. Dry etching damage of silicon: a review

pp.:  454 – 470

Chapter 80. Photoluminescence study of reactive-ion-etched silicon: a new boron-related defect

pp.:  470 – 474

Chapter 81. Photoluminescence of defects introduced by deuterium plasmas in silicon

pp.:  474 – 480

Chapter 82. Deep-level transient spectroscopy characterization of metallic contamination during plasma resist stripping

pp.:  480 – 484

Chapter 83. Mapping of electrically active defects in silicon by optical-beam-induced reflectance

pp.:  484 – 492

Chapter 84. Development of a scanning minority carrier transient spectroscopy method : application to the study of gold diffusion in a silicon bicrystal

pp.:  492 – 496

Chapter 85. An analysis of the oxygen condensation processes in silicon by laser-scanning tomography

pp.:  496 – 502

Chapter 86. Dispersive microwave transient spectroscopy of deep levels in semiconductors

pp.:  502 – 506

Chapter 87. Bonding in clusters and condensed matter : the role of electron correlations

pp.:  506 – 510

Author Index

pp.:  510 – 512

Subject Index

pp.:  512 – 519

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