Author: Cheng Z.N. Wang G.Z. Chen L Wilde J Becker K
Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.12, Iss.2, 2000-02, pp. : 31-36
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Improved Model for Impact of Viscoplastic Bodies
Key Engineering Materials, Vol. 2016, Iss. 715, 2016-11 ,pp. :
The analysis of creep data for solder alloys
Soldering & Surface Mount Technology, Vol. 15, Iss. 1, 2003-02 ,pp. :
New viscoplastic model to simulate hot isostatic pressing
By Sanchez L. Ouedraogo E. Federzoni L. Stutz P.
Powder Metallurgy, Vol. 45, Iss. 4, 2002-12 ,pp. :