Viscoplastic Anand model for solder alloys and its application

Author: Cheng Z.N.   Wang G.Z.   Chen L   Wilde J   Becker K  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.12, Iss.2, 2000-02, pp. : 31-36

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Abstract