On the degradation of the solder joints of underfilled flip chip packages: a case study

Author: Qun Zhang   Xiaoming Xie   Liu Chen   Guozhong Wang   Zhaonian Cheng   Kempe Wolfgang  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.12, Iss.3, 2000-12, pp. : 24-28

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