Fluxless plasma bumping of lead-free solders and the reliability effects of under bump metallization thickness

Author: Moon Joon Kwon   Zhou Y.   Jung Jae Pil  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.17, Iss.2, 2005-06, pp. : 3-9

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Abstract