Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Author： Andersson C.   Vandevelde B.   Noritake C.   Sun P.   Tegehall P.E.   Andersson D.R.   Wetter G.   Liu J.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.21, Iss.2, 2009-04, pp. : 28-38

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