Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.22, Iss.1, 2010-01, pp. : 4-10
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
The Mechanical Behaviour of Solders*
Soldering & Surface Mount Technology, Vol. 8, Iss. 1, 1996-01 ,pp. :
Dispersion strengthening for dimensional stability in low-melting-point solders
By Mavoori H. Jin S.
JOM, Vol. 52, Iss. 6, 2000-06 ,pp. :
By Chen Sinn-Wen Lin Chao-Ching Chen Chihming
Metallurgical and Materials Transactions A, Vol. 29, Iss. 7, 1998-07 ,pp. :