Effect of solder joint integrity on the thermal performance of a TEC for a 980?nm pump laser module

Author: Takyi G.   Amalu E.H.   Bernasko P.K.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.23, Iss.2, 2011-04, pp. : 115-119

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Abstract