Systematic mechanical design approach for a flexible printed circuit board assemblies (PCBA) rework cell: part II ‐ conceptual design of soldering and desoldering system

Author： Geren Necdet   Sarigül Çagdas   Bayramoglu Melih  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.24, Iss.3, 2012-06, pp. : 151-166

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Systematic mechanical design approach for a flexible printed circuit board assemblies (PCBA) rework cell: part I ‐ generic mechanical design procedure

By Geren Necdet   Sarigül Çagdas   Bayramoglu Melih  

Soldering & Surface Mount Technology, Vol. 23, Iss. 4, 2011-09 ,pp. : 244-256

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering

By Fejos Márta   Tersztyánszky László  

Soldering & Surface Mount Technology, Vol. 27, Iss. 2, 2015-04 ,pp. : 61-68

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

(Sn-Ag)eut+Cu soldering materials, part II: Electrical and mechanical studies

By Jacob K.   Jayadevan K.  

Journal of Phase Equilibria & Diffusion, Vol. 25, Iss. 2, 2004-04 ,pp. : 122-124

Springer Publishing Company

Access to resources Recommend Favorite

Thermo-mechanical behaviour of DBC substrate assemblies subject to soldering fabrication processes

By Camilleri Duncan  

Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 100-111

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Hole metallisation technology for microwave printed circuit board

By Ye Y.   Guo T. L.  

Transactions of the Institute of Metal Finishing, Vol. 87, Iss. 4, 2009-07 ,pp. : 217-220

Maney Publishing

Access to resources Recommend Favorite