High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)

Author： Beyne Eric Hoof Rita Van Webers Tomas Brebels Steven Rossi Stéphanie Lechleiter François Ianni Marianna Di Ostmann Andreas

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.18, Iss.3, 2001-12, pp. : 36-42

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