An investigation of the impact of a Ti barrier metal on the thermal stress field in passivated aluminium lines and vias in VLSI systems using finite element modelling approach

By Igic P. M.   Mawby P. A.  

International Journal of Electronics, Vol. 87, Iss. 11, 2000-11 ,pp. : 1289-1299

Taylor & Francis Ltd

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Temperature cycling analysis for ball grid array package using finite element analysis

By Zulkifli Muhammad Nubli   Jamal Zul Azhar Zahid   Quadir Ghulam Abdul  

Microelectronics International, Vol. 28, Iss. 1, 2011-01 ,pp. : 17-28

Emerald Group Publishing Ltd

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Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

By Kar Yap Boon   Talik Noor Azrina   Sauli Zaliman   Fei Jean Siow   Retnasamy Vithyacharan  

Microelectronics International, Vol. 30, Iss. 1, 2013-01 ,pp. : 14-18

Emerald Group Publishing Ltd

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Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method

By Chin J.W.C.  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 774-781

Springer Publishing Company

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Steady-state analysis of a precision hydraulic flow control servovalve using the finite element method

By Hiremath Somashekhar S.   Singaperumal M.   Kumar R. Krishna  

Journal of Micromechatronics, Vol. 3, Iss. 2, 2006-06 ,pp. : 103-122

VSP

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