Delamination and solder flow-out in underfilled and Pb-free flip chips on laminate

Author： Kleef Marc van   Bielen Jeroen   Gülpen Jan   Ramos Mike  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.22, Iss.2, 2005-08, pp. : 28-34

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