![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Bermell-Garcia P. Fan I-S.
Publisher: Inderscience Publishers
ISSN: 1743-5110
Source: International Journal of Product Lifecycle Management, Vol.3, Iss.1, 2008-08, pp. : 3-20
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Ibrahim Rahinah Paulson Boyd C.
International Journal of Product Lifecycle Management, Vol. 3, Iss. 1, 2008-08 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Grieves Michael W. Tanniru Mohan
International Journal of Product Lifecycle Management, Vol. 3, Iss. 1, 2008-08 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Kiritsis Dimitris Nguyen Van Khai Stark John
International Journal of Product Lifecycle Management, Vol. 3, Iss. 1, 2008-08 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Gomes Samuel Monticolo Davy Hilaire Vincent Mahdjoub Morad
International Journal of Product Lifecycle Management, Vol. 2, Iss. 4, 2008-05 ,pp. :