Non-destructive evaluation methods for subsurface damage in silicon wafers: a literature review

Author: Lu Weike   Pei Z.J.   Sun J.G.  

Publisher: Inderscience Publishers

ISSN: 1748-5711

Source: International Journal of Machining and Machinability of Materials, Vol.2, Iss.1, 2007-03, pp. : 125-142

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