Application of ultrasonic iterative deconvolution technique to the case of internal defect detection in multi-layered PCB components

Author： Raiutis R   Tumys O   Kays R   Maeika L  

Publisher： The British Institute of Non-Destructive Testing

ISSN： 1354-2575

Source： Insight - Non-Destructive Testing and Condition Monitoring, Vol.52, Iss.1, 2010-01, pp. : 27-33

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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