Research on parametric analysis for stress of Plastic Ball Grid Array solder joint under shock load

Author： Ping Yang   Jie Zhang   Dongyang Wu   Binghao Bao  

Publisher： Inderscience Publishers

ISSN： 0268-1900

Source： International Journal of Materials and Product Technology, Vol.31, Iss.2-3, 2008-04, pp. : 293-304

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