Author: Duving V.
Publisher: MAIK Nauka/Interperiodica
ISSN: 1061-8309
Source: Russian Journal of Nondestructive Testing, Vol.41, Iss.8, 2005-08, pp. : 544-549
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Thermography techniques for integrated circuits and semiconductor devices
Sensor Review, Vol. 27, Iss. 4, 2007-09 ,pp. :
High resolution thermal imaging inside integrated circuits
By Tessier G. Bardoux M. Filloy C. Boué C. Fournier D.
Sensor Review, Vol. 27, Iss. 4, 2007-09 ,pp. :