Phase diagram investigation and characterisation of ternary Sn In Me (Me = Ag, Cu) lead-free solder systems

By Milosavljevic Aleksandra   Zivkovic Dragana   Manasijevic Dragan   Talijan Nadezda   Cosovic Vladan   Grujic Aleksandar   Marjanovic B.  

International Journal of Materials and Product Technology, Vol. 39, Iss. 1-2, 2010-07 ,pp. : 95-107

Inderscience Publishers

Access to resources Recommend Favorite

Contribution towards clarification of Au–Sn phase diagram for Sn contents < 25at.-%

By Legendre B.   Hancheng Chhay   Hayes F.   Maxwell C. A.   Evans D. S.   Prince A.  

Materials Science and Technology, Vol. 3, Iss. 10, 1987-10 ,pp. : 875-876

Maney Publishing

Access to resources Recommend Favorite

Diffusion at Cu/Sn interface during sintering process

By Sánchez F.   Bolarín A. M.   Tello A.   Hernández L. E.   Bas J. A.  

Materials Science and Technology, Vol. 22, Iss. 5, 2006-05 ,pp. : 590-596

Maney Publishing

Access to resources Recommend Favorite

Experiments on the aging of Sn–Ag–Cu solder alloys

By Snugovsky L.   Perovic D.D.   Rutter J.W.  

Materials Science and Technology, Vol. 20, Iss. 8, 2004-08 ,pp. : 1049-1054

Maney Publishing

Access to resources Recommend Favorite

Al–Zn–Sn phase diagram – isothermal diffusion in ternary system

By Sebaoun A.   Vincent D.   Tréheux D.  

Materials Science and Technology, Vol. 3, Iss. 4, 1987-04 ,pp. : 241-248

Maney Publishing

Access to resources Recommend Favorite