Effects of rolling and sintering temperature on peel strength of bonding interfaces for Ag/Cu bimetallic strips

Author: Meng L.   Zhang L.   Zhou S. P.   Yang F. T.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.19, Iss.6, 2003-06, pp. : 779-784

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Abstract