Residual stress and stored energy during recrystallisation in polycrystalline copper

Author： Wierzbanowski K.   Baczmański A.   Wawszczak R.   Tarasiuk J.   Gerber PH.   Bacroix B.   Lodini A.  

Publisher： Maney Publishing

ISSN： 1743-2847

Source： Materials Science and Technology, Vol.21, Iss.1, 2005-01, pp. : 46-52

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