Experiments on the aging of Sn–Ag–Cu solder alloys

By Snugovsky L.   Perovic D.D.   Rutter J.W.  

Materials Science and Technology, Vol. 20, Iss. 8, 2004-08 ,pp. : 1049-1054

Maney Publishing

Access to resources Recommend Favorite

Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: a comparative study

By Ghosh M.   Gunjan M. K.   Das S. K.   Kar A.   Ghosh R. N.   Ray A. K.  

Materials Science and Technology, Vol. 26, Iss. 5, 2010-05 ,pp. : 610-614

Maney Publishing

Access to resources Recommend Favorite

Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi, Sb, P, Ag, and Cu on 60Sn–40Pb solder

By Carroll M. A.   Warwick M. E.  

Materials Science and Technology, Vol. 3, Iss. 12, 1987-12 ,pp. : 1040-1045

Maney Publishing

Access to resources Recommend Favorite

Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

By Narayan S   Prabhu K N  

Materials Science and Technology, Vol. 29, Iss. 4, 2013-04 ,pp. : 464-473

Maney Publishing

Access to resources Recommend Favorite

Phase diagram investigation and characterisation of ternary Sn In Me (Me = Ag, Cu) lead-free solder systems

By Milosavljevic Aleksandra   Zivkovic Dragana   Manasijevic Dragan   Talijan Nadezda   Cosovic Vladan   Grujic Aleksandar   Marjanovic B.  

International Journal of Materials and Product Technology, Vol. 39, Iss. 1-2, 2010-07 ,pp. : 95-107

Inderscience Publishers

Access to resources Recommend Favorite