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Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

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Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi, Sb, P, Ag, and Cu on 60Sn–40Pb solder

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