Effect of Ti on TLP bonding of SiCp/2618Al composites using interlayers of mixed Al–Ag–Cu system powders

Author: Huang J. H.   Wan Y.   Zhao H. T.   Cheng D. H.   Zhang H.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.23, Iss.1, 2007-01, pp. : 87-91

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content