Microstructures formed from mixed solders on copper substrate

Author: Snugovsky L.   Snugovsky P.   Perovic D. D.   Bagheri S.   Rutter J. W.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.25, Iss.12, 2009-12, pp. : 1467-1473

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Abstract