Transient liquid phase bonding of 6061-15 wt-%SiCp in argon environment using Cu powder interlayer

Author: Maity J.   Pal T. K.   Maiti R.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.25, Iss.12, 2009-12, pp. : 1489-1494

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Abstract