Effect of solution impurities on morphology and composition of copper electrodeposits obtained in membrane based cell

Author: Cifuentes L.   Grágeda M.   Casas J. M.   Vargas T.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.25, Iss.6, 2009-06, pp. : 753-759

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Abstract