Effect of interfacial bonding strength on thermal expansion behaviour of PM Al2O3/copper alloy composites

Author: Wan Y. Z.   Wang Y. L.   Luo H. L.   Cheng G. X.  

Publisher: Maney Publishing

ISSN: 1743-2901

Source: Powder Metallurgy, Vol.43, Iss.1, 2000-01, pp. : 76-78

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Abstract