Interfacial microstructure between thick aluminium wires and aluminium alloy pads formed by ultrasonic bonding

Author: Maeda M   Kitamori S   Takahashi Y  

Publisher: Maney Publishing

ISSN: 1743-2936

Source: Science and Technology of Welding & Joining, Vol.18, Iss.2, 2013-02, pp. : 103-107

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Abstract