Author： Çam G. Müllauer J. Koçak M.
Publisher： Maney Publishing
ISSN： 1743-2936
Source： Science and Technology of Welding & Joining, Vol.2, Iss.5, 1997-10, pp. : 213-219
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Abstract
Solid state diffusion bonding of TiAl was carried out with different bonding parameters within the superplastic temperature range. The effect of post-bond heat treatment (PBHT) on the mechanical properties of the bonds was also studied. Defect free sound bonds were achieved within the temperature range 925–1150°C and the pressure range 20–40 MPa. Transverse microtensile specimens extracted from the bonds were tested to evaluate room temperature tensile properties of the bonds and to correlate them with bonding parameters. The bond strength increased with an increase in bonding temperature and pressure. All the specimens of the bond made at 925°C and 40 MPa, and most of the specimens of bonds made at 1000°C and 30 MPa and at 1100°C and 20 MPa, failed in the bond area; all the specimens of bonds made at 1100°C and 30 MPa and at 1150°C and 20 MPa failed in the base metal. Post-bond heat treatment at 1350°C for 1 h led to the transformation of the recrystallised γ grains at the bond inteface formed during bonding to a lamellar microstructure, resulting in an indiscernible bond line in all cases. This resulted in an improvement in the bond strength in most of cases. Moreover, the recrystallised γ grains were also formed away from the bond area in the bonds made at 1100°C and 30 MPa and at 1150°C and 20 MPa. After PBHT, these bonds exhibited slightly lower tensile strength values owing to the change in the base metal microstructure away from the bond area.
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