Author: Salehi M. Hosseini R.
Publisher: Maney Publishing
ISSN: 1743-2944
Source: Surface Engineering, Vol.12, Iss.3, 1996-01, pp. : 221-224
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Dissolution behaviour of Ti/Cu contact reaction
By Wu M. F. Yu C. Yu Z. S. Qi K. Li R. F.
Materials Science and Technology, Vol. 21, Iss. 2, 2005-02 ,pp. :
Electrodeposition and characterisation of Cu‐CeO 2 nanocomposite coatings
By Ramalingam S
Surface Engineering, Vol. 29, Iss. 7, 2013-08 ,pp. :