LTCC technology for cost-effective packaging of photonic modules

Author： Heilala J. Keränen K. Mäkinen J.-T. Väätäinen O. Kautio K. Voho P. Karioja P.

ISSN： 0144-5154

Source： Assembly Automation, Vol.25, Iss.1, 2005-03, pp. : 30-37

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