Publisher： Emerald Group Publishing Ltd
ISSN： 0305-6120
Source： Circuit World, Vol.20, Iss.2, 1993-12, pp. : 5-7
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
When implementing chip-on-board (COB), the surface finish on the printed wiring board needs to be chosen with several key considerations in mind. The choice of bonding technology dominates the selection of finishes. Wire bonding, tape automated bonding and flip chip assembly all have their own special requirements for effective assembly. The considerations must also examine the presence of intermetallics in the solder joints. These issues are discussed along with several advanced techniques for applying solder coating and organic solderability preservatives on bare copper PWBs.
Related content
Surface finishes in a lead-free world
By Milad George
Circuit World, Vol. 34, Iss. 4, 2008-11 ,pp. :
Access to resources
Recommend
Reliability comparison of different surface finishes on copper
By Yee Shelgon Ladhar Harjinder
Circuit World, Vol. 25, Iss. 1, 1999-01 ,pp. :
Gold and aluminum wire bonding to palladium surface finishes
By Fan Chonglun Abys Joseph A Blair Alan
Circuit World, Vol. 25, Iss. 3, 1999-03 ,pp. :
Alternative surface finishes - options and environmental considerations
By Kellner Rod
Circuit World, Vol. 30, Iss. 2, 2004-03 ,pp. :