Microstructure of Conductive Anodic Filaments Formed during Accelerated Testing of Printed Wiring Boards

Author: Ready W.J.   Stock S.R.   Freeman G.B.     Turbini L.J.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.21, Iss.4, 1993-12, pp. : 5-9

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Abstract