Comparison of the dielectric constant and dissipation factors of non-woven aramid/FR4 and glass/FR4 laminates

By Khan Subhotosh  

Circuit World, Vol. 26, Iss. 2, 2000-02 ,pp. : 33-37

Emerald Group Publishing Ltd

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Characterization of a non-woven randomly dispersed short fiber laminate

By Pecht Michael   Rogers Keith   Fowler Andre  

Circuit World, Vol. 24, Iss. 3, 1998-03 ,pp. : 34-37

Emerald Group Publishing Ltd

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High Speed Laser Ablation of Microbial Holes in Non-woven Aramid Reinforced Printed Wiring Boards to Reduce Cost*

By Weinhold M   Powell** D J  

Circuit World, Vol. 22, Iss. 3, 1996-03 ,pp. : 16-22

Emerald Group Publishing Ltd

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Predicting the Punchability of Laminates

By Rippington G.W.   Holmes J.B.  

Circuit World, Vol. 7, Iss. 4, 1993-12 ,pp. : 4-8

Emerald Group Publishing Ltd

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Standards for Copper-Clad Laminates

By Ross W. MacLeod  

Circuit World, Vol. 3, Iss. 1, 1993-12 ,pp. : 46-50

Emerald Group Publishing Ltd

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